Packaging Engineer
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Position Overview & Specifications
An exciting new job has arisen for a Packaging Engineer, based in Sedgefield, Stockton-On-Tees to work for an world leader in the design and manufacture of custom RF, microwave and millimetre wave components and subsystems.
The Packaging Engineer, located in Sedgefield, Stockton-On-Tees will be responsible leading the packaging assembly technology development across the business, to enhance the package design capability, to deliver advanced, integrated solutions.
The ideal Packaging Engineer, based in Sedgefield, Stockton-On-Tees will have experience in the semiconductor or compound semiconductor package manufacturing processes, ideally specifically with wafer bumping, flip-chip, wire-bond, Underfill, SMT and other packaging technologies.
APPLY NOW! For the Packaging Engineer job, located Sedgefield, Stockton-On-Tees by sending a cover letter and CV to TDrew@redlinegroup.Com or by calling Tom Drew on 01582 878848 quoting ref. THD1164. Otherwise, we always welcome the opportunity to discuss other roles similar to Packaging Engineering jobs on 01582 878 848
Candidate Selection & Onboarding Process
Application & Resume Screening
Submit your tailored CV/Resume directly to the talent acquisition portal.
Technical & Competency Interviews
Virtual interviews with the hiring manager and multidisciplinary team.
Formal Offer & Benefits Negotiation
Written agreement outlining compensation, equity, retirement vesting, and relocation allowances.
Onboarding & Corporate Integration
Equipment provisioning, team orientation, and commencement of duties.
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